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GaN/SiC HEMT Technologies

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0.25/0.4/0.15µm GaN HEMT Process:

  • High Electron Mobility Transistor
  • Wide band-gap GaN HEMT
  • A Combination of high power density, high efficiency, and wide bandwidth
  • Ideal for 5G wireless infrastructure and radar applications (PA and switches)
  • 15, 28, 48, and 85V PA operations

Typical Applications:

  • 5G wireless infrastructures
  • Amplifiers with DPD for FDD, TDD conditions
  • Military/commercial radar
  • Military electronic warfare (EW)
  • 5G Doherty amplifier

Features:

  • 0.15/0.25/0.4 µm T-Gate lithography - with source/gate field plates
  • Psat: ~6 W/mm @ Vds = 28 V
  • Psat: ~11 W/mm @ Vds = 48 V
  • High drain efficiency: > 80%
  • High breakdown voltage: > 200 V
  • Excellent thermal conductivity
  • Options of round or slot through-wafer vias

Typical GaN Device Performance:

Parameter0.15um0.4um0.25um
Imax (mA/mm)115011901200
Idss(mA/mm)910730750
Gm (mS/mm)343300330
Vp (V)-3-2.6-2.4
BVgd (V)80>200>150
MAG @ 2.0 GHz (dB)16>24>26
ƒT(GHz)421923
ƒmax(GHz)17062100
Pout (W/mm)@3.5 GHz,Vds-48VN/A13.511.0
PAE(%)@3.5GHz, Vds-48VN/A81.079
Pout (W/mm)@15 GHz,Vds-28VN/AN/A4.0
PAE(%)@15GHz, Vds-28VN/AN/A45
Pout (W/mm)@10 GHz,Vds-48VN/A10.310.8
Max. Drain Eff. (%) @10 GHz,Vds-48VN/A5765
Nfmin@10 GHz -28VN/A1.15dB1.1dB
MXP Psat (W/mm) @ 18GHz, Vds = 28V5N/AN/A
MXE PAE (%) @ 18GHz, Vds = 28V60N/AN/A
MXP Psat (W/mm) @ 30GHz, Vds = 28V4.6N/AN/A
MXE PAE (%) @ 30GHz, Vds = 28V49N/AN/A
NFmin (dB) @ 18GHz, Vds = 20V0.77N/AN/A

 

GaN/SiC HEMT 0.15um
0.15um GaN/SiC HEMT

 

GaN/SiC HEMT 0.25um
0.25um GaN/SiC HEMT

 

GaN/SiC HEMT 0.4um
0.4um GaN/SiC HEMT

 

Round and Slot Through Wafer Vias
Available Round & Slot Through Wafer Vias
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