GCS high speed 850nm multimode Vertical Cavity Surface Emitting Laser (VCSEL) chips are primarily designed for up to 400Gbps data communications and are specifically tailored for consumer-based active optical components (AOC) and optical USB (OUSB) applications. This high performance device has high reliability and is engineered with low electrical parasitics. The VCSEL has a circular low divergence beam that can be efficiently coupled into a 50/125 or 62.5/125um multimode fiber. The device can also be arranged in linear 1x4, 1x8, or 1x12 arrays in a common cathode configuration, with 250m pitch between each channel, for up to 400Gbps applications.
Key Features
- 850nm multimode emission
- Low threshold and operation current
- Excellent reliability
- Data rates up to 400 Gb/s for singlet chip
- Optimized for -5C to 70C operation
- High reliability with GCS robust 4” wafer manufacturing with fast cycle-time
- Deliverable in GCS Known Good Die™ with 100% testing and inspection
- Customized 1x4 array or other arrays layout available
- RoHS compliant
Applications
- Up to 400Gbps data communication
- Active Optical Cable
- Optical USB
- HDMI
GaAs PIN VCSEL - Wavelength: 850nm
| Part Number | Data Rate | Die Size (Single) (um x um) | Pad Design | Single/ Array |
| DO314B_VCSEL_8G | 8Gbps (3dB BW: 7.5GHz) | 250 x 250 Pitch = 250um | P/N on top | Singlet/ Array (1x4, 1x8, 1x12) |
| DO314_VCSEL_10G | 10Gbps (3dB BW: 8.5GHz) | 250 x 250 Pitch = 250um | P/N on top | Singlet/ Array (1x4, 1x8, 1x12) |
| DO385_VCSEL_25G | 25Gbps (3dB BW: 18GHz) | 210 x 210 Pitch = 250um | P/N on top | Singlet/ Array (1x4, 1x8, 1x12) |
| DO385_VCSEL_28G (PAM4) | 28Gbps (3dB BW: 18GHz) | 210 x 210 Pitch = 250um | P/N on top | Singlet/ Array (1x4, 1x8, 1x12) |