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0.1µm Low-Noise & Power pHEMTs​

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  • EBL Gate Lithography
  • Ideal for mmW Transceiver Components
  • Suitable for Commercial and A&D Applications
  • Meets or Exceeds Environmental Requirements

For Applications up to Ka-Band:

  • Transceiver Components
  • High Power Amplifiers
  • Low Noise Amplifiers
  • Gain Blocks
  • Switches

Features:

  • EBL Gate Lithography
  • Excellent Reliability
  • Backside Round & Slot Via Process
  • Hot Via Process
  • High Level MMIC Implementation

Typical Device Performance:

ParameterLNPower
Imax (mA/mm)440430
Idss (mA/mm)220322
Gm (mS/mm)430383
Vp(V)-0.5-1.03
BVgd (V)>7>16
ƒT (GHz)8058
ƒmax (GHz)170>210
P_density (mW/mm)N/A630
NFmin @ 6 GHz [dB]0.40.49
Gass @ 6 GHz [dB]17.714.8
NFmin @ 12 GHz [dB]0.470.76
Gass @ 12 GHz [dB]12.510.9
NFmin @ 18 GHz [dB]0.550.98
Gass @ 18 GHz [dB]11.09.3
NFmin @ 30 GHz [dB]*1.2N/A
Gass @ 30 GHz [dB]*9.0N/A
* extrapolated
0.1µm Power pHEMT Process:
0.1µm Power pHEMT Process
0.1µm LN pHEMT Process
0.1µm LN pHEMT Process
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