GCS has developed high-Q, small-size passive IC elements for integration with GaAs PA and switch chips to further reduce cell phone front-end module size and cost. Large through-substrate vias are also available with IPD process.
Process Features:
- Thin-Film Resistor
- MIM Capacitor
- Thick Metal for High-Q, Compact Spiral Inductors
- Air-bridge or Polyimide Interconnect Options
- Passive Integrated Circuits