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RF Semiconductor Foundry

0.25µm & 0.5µm Power pHEMT

 

Process Summary

 

Available in 0.25 µm and 0.5 µm process nodes, this technology uses optical gate lithography to support low-cost manufacturing. It is suited for PA, LNA, and switch applications and meets or exceeds environmental requirements.

Typical Applications up to Ka-Band

 
  • High Power Amplifiers
  • Low Noise Amplifiers
  • Gain Blocks
  • Transceiver Components
  • Switches

Key Features

 
  • AlGaAs/InGaAs/GaAs Material
  • Optical T-Gate Stepper Lithography
  • Double-Recess Gate
  • Low-Cost Production Process
  • Excellent Reliability
  • Backside Round and Slot Via Process

Typical Device Performance

 
0.5µm Power pHEMT Process – Ku Band PA for VSAT 0.5µm Power pHEMT Process – Ku Band PA for VSAT
0.25µm Power pHEMT Process – Vds=6V, Vgs=-0.16V at 30 GHz 0.25µm Power pHEMT Process – Vds=6V, Vgs=-0.16V at 30 GHz

Power Performance Data

 
Parameter0.5µm0.25µm
Imax (mA/mm)500500
Idss (mA/mm)250270
Gm (mS/mm)340350
Vp (V)-1-1
BVgd (V)>15>18
Ft (GHz)3350
Fmax (GHz)90170
P_density (mW/mm)900*650
* Vd=7V; Frequency=2 GHz
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