Test Program Development
GCS has extensive experience in DC/RF test program development for customer products. Once test requirements and specifications are defined, GCS can work with the customer to procure DC/RF probe cards and perform on-wafer testing. Test data can be binned according to customer-defined specifications. GCS can either ink rejected dies or provide an electrical wafer map to the offshore assembly house. This on-wafer test solution helps reduce overall customer assembly costs.
DC/RF Testing Capabilities
- Automated DC Test Systems (Production)
- PCM and 100% on-wafer Die Testing
- RF Test and Characterization Systems
- Automated Production Test Setup
- On-wafer S-parameters Testing (.05–18 GHz)
- On-wafer Large signal gain testing
- Engineering Test Setup
- Network Analyzer (.05–40 GHz): Insertion and return loss, Isolation, S-parameters, DC parameters, Device modeling
- Load pull test capabilities:
- (0.8–18 GHz): Source/load pull, Noise parameters, IP3, Harmonics, Ruggedness
- (6–40 GHz): Source/load pull, Noise parameters, IP3, Harmonics, Ruggedness
- Automated Production Test Setup