Integrated Passive Device (IPD)

MMIC passive technology designed for compact size and low-cost manufacturing, enabling reduced component count for improved front-end module integration. It is ideal for low-pass filters and off-chip matching networks, and meets or exceeds environmental requirements. It also features large through-wafer via openings to support coplanar heterogeneous integration.

• Off-Chip Matching Elements/Power combiners
• Bandpass Filters (low & high-band) for Cell Phone PA
• Minimize Parasitic and Interconnects for High-Frequency Module Integration of Different Chips

• Thin-Film Resistor
• MIM Capacitor
• Thick Metal for High-Q, Compact Spiral Inductors
• Air-bridge or Polyimide Interconnect Options
• Passive Integrated Circuits