6" GaAs, GaN/Si and wafer processing
- 2”, 3”, 4” GaAs, InP, GaN, and SiC wafer processing
- Stepper & Contact Photolithography
- Metal: Ti, Pt, Au, Au/Ge, Ni, TiW, Al, Ta, TaN, NiCr
- E-beam evaporation & sputtering
- Electro-plating for thick metals
- Air-bridge process
- Dielectrics
- SiNx, SiO2, Polyimide, BCB
- P/n-ohmic contacts (alloyed/non-alloyed)
- Schottky contacts
- Wet or dry mesa etch
- RIE or plasma dry etch
- Deep, vertical ICP dry etch
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